電學(xué)特性

FEOL Electrical Characterization
In IC device manufacturing electrical characteristics of layers and films must be well controlled. Conventional contact test methods on monitor wafers, like the 4-point probe FSM offers, do no longer meet modern requirements. State of the art IC feature extremely thin, often only a few atomic layers of material. FSM's contactless RsL probe for sheet resistance and leakage as well as the non-destructive EOT probe for IC-CV measurements meet the challenge to characterize ultra shallow junctions and thin dielectric materials on production wafers.

FSM offers contact and non-contact electrical characterization metrology used in FEOL device making.

3DIC TSV and BWS TTV硅片表面形貌測(cè)量
Film Stress薄膜應(yīng)力量測(cè)儀
FEOL Electrical Characterization 電學(xué)特性
Thin wafer metrology 晶圓測(cè)量學(xué)
Film Adhesion漆膜附著力測(cè)試

FSM offers contact and non-contact electrical characterization metrology used in FEOL device making.